Solder

Lead-Free BGA Rework Course

DESCRIPTION OF COURSE COURSE OUTLINE SCHEDULE REGISTRATION CONTACT US
COURSE OUTLINE

DAY 1

  • Introduction/Course Overview
  • Introduction to Ball Grid Arrays and Micro Ball Grid Arrays
  • Hardware Overview
  • Safety Lecture
  • Operator Training
  • Main director functions
  • Running the operator training profile
  • Inspection-XRAY, Endoscope and Visual

DAY 2

  • De-soldering
  • Site Prep and Cleaning
  • Solder Paste Application
  • BGA Removal, Site Prep and Replacement