COURSE OUTLINE

DAY 1

• Introduction/Course Overview
• Introduction to Ball Grid Arrays and Micro Ball Grid Arrays
• Hardware Overview
• Safety Lecture
• Operator Training
• Main director functions
• Running the operator training profile
• Inspection-XRAY, Endoscope and Visual

DAY 2

• De-soldering
• Site Prep and Cleaning
• Solder Paste Application
• BGA Removal, Site Prep and Replacement