Adhesive-backed single use rework stencil prevents solder from squirting underneath the stencil thereby eliminating multiple reworks. Allows for squeegeeing into tight spaces as it is made from flexible mylar film with repositionable adhesive allowing you to print more easily on heavily-populated boards. This simplifies the rework printing process as multiple passes insure proper fill of apertures and a more consistent print volume.
This stay in place stencil simplifies BGA rework as balls can fit tactily in to the stencil apertures greatly simplifying BGA rework. This stencil repairs solder mask damage thereby saving repair time. It also prevents solder shorting as insulation of the Kapton™ provides a barrier.
Allows much simpler placement of leadless devices like QFNs and LGAs. This process method reduces voiding as devices are “bumped” prior to placement. This is a much faster and consistent rework method for leadless devices
Ruggedized stencils are cost effective for large rework projects