REWORK STENCILS

Adhesive-backing prevents solder from squirting underneath the stencil thereby eliminating multiple reworks. Allows for squeegeeing into tight spaces as made from flexible mylar film with repositionable adhesive allowing you to print more easily on heavily-populated boards. Simplifies printing process as multiple passes insure proper fill of apertures and a more consistent print volume.

Simplifies BGA rework as balls can fit tactily in to the stencil apertures greatly simplifying BGA rework Repairs solder mask damage thereby saving repair time Prevents balls from shorting one to another.

Allows much simpler placement of leadless devices like QFNs and LGAs. This process method reduces voiding as devices are “bumped” prior to placement. This is a much faster and consistent rework method for leadless devices

Ruggedized stencils are cost effective for large rework projects