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The current procedure of replacing all the soldered balls on the chip ball grid array is mainly noted as BGA reballing. This method of bga reballing will actually allow the ICs to use the package type … read more

If you are looking for a career in demand, then it may be time to consider pursuing PCB inspection training. It is projected that by 2022 there will be over 140,000 jobs … read more

Solder is a fusible metal alloy that helps create permanent bonds between various metals on a circuit board. The process of joining metal pieces together using molten solder is known as soldering. Wit … read more

BGA stands for Ball Grid Array, i.e., a surface-mount packaging developed specifically to mount necessary devices on printed circuit boards such as microprocessors. It has been one of the latest techn … read more

See the latest SMT007 article on X-RAY imaging after BGA rework here.