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Hot Air vs Infrared Printed Circuit Board Rework

Hot Air vs Infrared Printed Circuit Board Rework

Posted by Nash Bell on Jul 28th 2026

Overview of PCB Rework Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled printed circuit board. Rework may be require … read more
X-Ray Inspection of Ball Grid Array Solder Joints

X-Ray Inspection of Ball Grid Array Solder Joints

Posted by Nash Bell on Jul 28th 2026

Advantages of BGA Devices Ball grid array (BGA) devices are omnipresent throughout electronic products primarily due to numerous advantages including compact packaging, a durable format relative to le … read more
Knocking Down the Bone Pile: Basics of Component Lead Tinning

Knocking Down the Bone Pile: Basics of Component Lead Tinning

Posted by Nash Bell on Apr 2nd 2025

The component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversio … read more
Unlocking Precision: Elevate Your Electronics Sorting with BEST

Unlocking Precision: Elevate Your Electronics Sorting with BEST

Posted by Staff - Soldertraining on Oct 30th 2023

When it comes to the world of electronics and PCB board sorting, you need a partner who can not only meet your expectations but exceed them. BEST stands as the proven leader of expertise and excellenc … read more