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One of the most frequent causes of BGA repair and rework is that the tin solder balls, the "ball" in the ball grid array, lose reliability due to the board's typical heating cycle, which results in co … read more

Have you ever wondered if every operator is able to handle your BGA rework task flawlessly? Well, the answer is a resounding no. Not every operator knows the tricks and tips to get the BGA work cov … read more

Thousands of BGA components are discarded yearly due to flaws, damage, or incompatibilities. However, many discarded elect … read more

There was no generally accepted workmanship standard in the wire harness business before the creation of the IPC/WHMA A-620 standard. Because of this lack of standardization, wire harness manufacturer … read more

The inspection of BGAs requires an experienced, skilled eye for inspection as soldering a BGA can have many potential flaws. These problems can al … read more

Ball Grid Array (BGA) mass-produced devices may not perform at their best for various reasons. Performance difficulties may arise from a variety of causes, including design flaws, insufficient or e … read more

Please find the updated article on BGA rework challenges here.

Soldering operations rarely result in 100% error-free assemblies. Occasionally, not even the best parts will hold up. This is why it's crucial for individuals who create, maintain, or repair PCBs to b … read more