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The inspection of BGAs requires an experienced, skilled eye for inspection as soldering a BGA can have many potential flaws. These problems can al … read more

Ball Grid Array (BGA) mass-produced devices may not perform at their best for various reasons. Performance difficulties may arise from a variety of causes, including design flaws, insufficient or e … read more

Please find the updated article on BGA rework challenges here.

Soldering operations rarely result in 100% error-free assemblies. Occasionally, not even the best parts will hold up. This is why it's crucial for individuals who create, maintain, or repair PCBs to b … read more

The article was updated and posted here.It details how to handle a mixed alloy hand soldering environment … read more

Technology advancements have led to a reduction in physical size and an increase in the complexity of electronic gadgets. The BGA (Ball Grid Array) packaging can be used to meet the growing demand for … read more

Hand soldering is an easy and common soldering method in electronics assembly. In this operatio … read more

IPC 610 certification is the document on which IPC-A-610 training is based. It contains the standards for assembled electronics. When the … read more