Brief Guide to BGA Replacement and Reworking

Brief Guide to BGA Replacement and Reworking

Posted by Staff - Soldertraining on Oct 1st 2022

Ball Grid Array (BGA) mass-produced devices may not perform at their best for various reasons. Performance difficulties may arise from a variety of causes, including design flaws, insufficient or excessive solder joints, and mistakes made during upgrade procedures.

BGA Replacement and Reworking can fix these flaws and keep SMT circuit boards functioning properly. BGAs are complex systems that require a high level of knowledge to refurbish or repair them. A ball grid array repair often entails unsoldering the printed circuit board and then resoldering the electronic parts that are surface mounted.

A reputable supplier of high-quality Ball Grid Array assembly and component services should perform the required BGA Rework & Reballing. They need cutting-edge BGA to rework systems and a skilled team of specialists well-versed in BGA technology.

Included in BGA repair and rework services are:

PCB Reballing: In this BGA repair and rework services, they reball SMT PCBs with various BGA designs, such as lead-free ball BGA, eutectic-ball BGA, and high-temperature Chip Ball Grid Array (CBGA).

Repair of SMT pads and tracks: It can fix any damage to the PCB surface caused by these components. Even subpar work that could have been done on the PCB can be fixed.

Site Modification for BGA: Jumper wires are necessary for a Ball Grid Array (BGA) site change. Use flat, thin ribbon jumper wires that slide under the BGA component without difficulty. By doing this, the modification criterion is satisfied without significantly altering the BGA site.

BGA pads that are damaged or missing can be repaired using adhesives approved by the industry.

Component removal and replacement: BGA pads can be removed and replaced using air vacuum equipment.

The broken solder mask between the BGA pads and connecting vias must be repaired to stop the solder from running down the vias during BGA replacement.

By using the IPC-recommended BGA Pad Repair Procedure, damaged or missing BGA pads can be replaced. During this process, the board surface is thermally attached to specially constructed adhesive-backed BGA pads.

X-ray examination: Every board we process undergoes site inspection and X-ray services for BGA components to guarantee the highest level of quality. This technique will identify flaws, including shorts, opens, and voids in solder joints. A variety of solder joint faults are shown in this X-ray image.

The combination of BGA Component Removal and Replacement gives you a repeatable procedure with every project fulfilling the highest quality standards.

Don't discard broken PCBs and your investment along with them. Not every printed circuit board business can consistently complete these repairs and provide high-quality outcomes. It would be best if you had a reputable, qualified company with the right employees, equipment, and BGA services to deliver excellent results.