The popularity of BGA and CBGA packing has been explosive in the PCB industry over the last few years. BGAs offer better first time yields and have proven to be very reliable. Unfortunately, the cost of rework per component has increased substantially for BGAs as a result of the equipment, training and probability of damage. With the advent of lead-free solder alloy balls being used in combination with or on its own this challenge has grown. The rising costs of assemblies and BGA components has led to the outsourcing for the rework of lead-free BGAs. For those companies that want to have the capability of reworking lead free BGAs, BEST offers the Lead-Free BGA Rework Certification.
The lead free BGA Certification course is a comprehensive course that encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. During the course, the student will be introduced to component identification, terms and definitions, re-balling techniques, pasting, placing and reflowing, and hands-on soldering/desoldering techniques utilizing state-of-the-art workstations. This course is structured to be in accordance with IPC-A-610, IPC-7711 and IPC-7721.
This class utilizes the following equipment for BGA Rework and Inspection:
This is a 2-day, primarily hands-on course It is a basic skills course, designed to teach selected content to beginning soldering techs.
Each graduate will receive a certificate of completion from BEST.