This course is an advanced version of the surface mount technology hand soldering class giving the student an up-close look at more advanced SMT packaging styles. During the course, the student will be introduced to several soldering techniques to perform the rework of most surface mount component styles. SMT package types to be soldered and desoldered include: 0404 and 0201 chip style parts, 15 and 20 mil pitch 15 and 20mil pitch TSOP and QFPs, PLCC sockets and other area array devices. This course is structured to be in accordance with IPCA-610 and IPC-7711.

Topics Covered:

• Review of advanced SMT Component IDs
• Soldering & Desoldering of Chip Style components (0402's, 0201's)
• Soldering & Desoldering of Fine Pitch TSOPs and QFP's 15 and 20mil pitch
• Soldering and Desoldering of Sockets
• Introduction to micro BGAs