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Advanced Hand Assembly for Lead-Free Processes Course

DESCRIPTION OF COURSE COURSE OUTLINE SCHEDULE REGISTRATION CONTACT US

COURSE OUTLINE

DAY ONE

  • Advanced SMT Component ID
  • Soldering and De-soldering of 0402 and 02010 Chip Style Components
  • Soldering and De-soldering of 15 and 20 mil pitch TSOP and QFPs

DAY Two

  • Soldering and De-soldering of 15 and 20 mil pitch TSOP and QFPs
  • Conductive Soldering Techniques

DAY Two

  • Soldering and Desoldering of 15 and 20 mil pitch QFPs
  • Soldering of Sockets
  • Introduction to BGA and Micro BGAs-profiling, thermocoupling, inspection, X-RAY

Lead-Free Courses

Lead-Free Hand Soldering Introduction

Lead-Free BGA Rework

Lead-Free Mixed Technology Rework

Lead-Free SMT Rework

Advanced Hand Assembly


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