Advanced Hand Assembly for Lead-Free Processes Course
DESCRIPTION OF COURSE COURSE OUTLINE SCHEDULE REGISTRATION CONTACT US
COURSE OUTLINE
DAY ONE
- Advanced SMT Component ID
- Soldering and De-soldering of 0402 and 02010 Chip Style Components
- Soldering and De-soldering of 15 and 20 mil pitch TSOP and QFPs
DAY Two
- Soldering and De-soldering of 15 and 20 mil pitch TSOP and QFPs
- Conductive Soldering Techniques
DAY Two
- Soldering and Desoldering of 15 and 20 mil pitch QFPs
- Soldering of Sockets
- Introduction to BGA and Micro BGAs-profiling, thermocoupling, inspection, X-RAY
Mobile Training Center