COURSE OUTLINE

DAY 1

• Introductions
• Electrostatic Discharge
• Component Placement and Alignment
• Solder Joint Identification
• The Basics of Soldering

DAY 2

• Lead-Free Through-Hole Soldering and Desoldering
  • Techniques and Procedures for:
    • 1/4 and 1/2 Watt Resistors
    • DO - 35 Diode
    • CK05 Box Capacitors

    DAY 3

    • Lead-Free Through-Hole Soldering (continued)
      • Techniques and Procedures for:
        • TO - 18 Transistor
        • 16 Lead Dual In-Line Package (DIP)
    • History of Lead-Free SMT
    • Lead-Free SMT Component Identification
    • Component Placement and Alignment

    DAY 4

    • Lead-Free SMT Soldering and Desoldering
      • Techniques and Procedures for:
        • Lead-Free Chip Style and Cylindrical Components (1206, 0805, 0603, tantalum caps, and MELFs)
        • Lead-Free Small Outline Transistor Components (SOT 23s)

    DAY 5

    • Lead-Free SMT Soldering and Desoldering
      • Techniques and Procedures for:
        • Lead-Free Small Outline Integrated Circuit Components (SOIC 14, 20)
        • Lead-Free Quad-Flatpack (QFP 80)
        • Lead-Free Plastic Leaded Chip Carrier (PLCC 44)