BGA Reballing Challenges

There are some common areas inexperienced BGA assembly technicians may run into in the reworking of BGAs including:

Popcorning and component damage -this is particularly prevalent on very thin devices (MSD Class 1):

Popcorned BGA

Other challenges regarding BGA reballing include:

• Component damage due to improper reflow temperature
• Improper temperature profile
• Ceramic part reballing-paste printing onto select areas of the PCB lands

Warped BGA

Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.