Solder

Ceramic Package Reballing

General
Process
  BGA
Handling
  StencilQuik™
Method
  EZReball™
Method
  High Volume
Method
Dry
Packaging
Ceramic
Package Reballing
Challenges
 
Optional
Services

There are some common areas inexperienced BGA assembly technicians may run into in the reworking of BGAs including:

Popcorned BGAPopcorned BGA

Other challenges regarding BGA reballing include:
  • Component damage due to improper reflow temperature
  • Improper temperature profile
  • Ceramic part reballing-paste printing onto select areas of the PCB lands

Warped BGAWarped BGA

Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.
Ionic Cleanliness Testing

An ion chromatograph (IC) is the most common tool for precision testing of device cleanliness. This method can quantify and identify specific ionic species that are present on an electronic device.  The most common test method followed is the IPC TM-650 2.3.28.  The device is placed into an ionically-clean bag (e.g. Kapak), and is immersed in an extract solution of 75% isopropyl alcohol (IPA) to 25% de-ionized water.  It is important to be sure that the sampling procedures do not introduce any ionic contaminates.  The PCB is extracted in the solution for one hour at 80 degrees centigrade, the resulting extract is then injected into the ion chromatograph.  The IC then separates and detects each individual ion for which it was calibrated. Click here to see an Ionic Cleanliness testing report (PDF).