Optional BGA Reballing Services

Optional / Additional BGA Reballing Services

There are a variety of end customer requirements which sometimes call for additional processing in the BGA reballing process.  These steps could include some form of automated optical inspection, laser etching, retaping of parts, or localized ionic contamination level testing.  We offer all of these services for complete success in your rework project.

Automated Optical Inspection

BGA / CSP Inspection. 100% inspection of ball diameter, ball quality, missing balls and co planarity is done with an automated optical inspection system.  Set-up and programming time as well as processing time are a part of this service.

Laser Marking

BEST offers accurate laser marking  of reballed BGAs. Laser marking can incorporate any size fonts or graphic images as small as 5x5 mm.

If the devices were initially purchased having lead-free alloy balls and we have re-attached leaded balls, we suggest the following symbol be LASER marked (E0).
If the devices were initially purchased having tin-lead alloy balls and we have re-attached lead-free balls, we suggest the following symbol be LASER marked (E1).

laser-marked-reballed-bgaLaser marked and reballed BGA

Ionic Cleanliness Testing

An ion chromatograph (IC) is the most common tool for precision testing of device cleanliness. This method can quantify and identify specific ionic species that are present on an electronic device.  The most common test method followed is the IPC TM-650 2.3.28.  The device is placed into an ionically-clean bag (e.g. Kapak), and is immersed in an extract solution of 75% isopropyl alcohol (IPA) to 25% de-ionized water.  It is important to be sure that the sampling procedures do not introduce any ionic contaminates.  The PCB is extracted in the solution for one hour at 80 degrees centigrade, the resulting extract is then injected into the ion chromatograph.  The IC then separates and detects each individual ion for which it was calibrated. Click here to see an Ionic Cleanliness testing report (PDF).

Taping and Reeling

The taping and reeling of electronic components will protect them from the dangers of ESD, transportation and atmospheric change.  In addition, the components are presented to Pick & Place machines in a fashion which optimizes the efficiency of the mounting process. 

When product is delivered to a Reel Service facility, it is immediately subject to strict climate and ESD controls.  It is initially logged into our computer tracking system, inspected and scanned for rejects.  The components are then transferred to our production area, where they can be taped and reeled manually or automatically.  !00% inspection and vision systems can supplement the process.  The finished reels are then transferred to shipping to be vacuum packed and prepared for delivery.