BEST soldering geeks enable electronics companies to be more effective through professional instruction, tools and taking secondary assembly projects off your plate
General
Process BGA
Handling StencilQuik™
Method EZReball™
Method High Volume
Method Dry
Packaging Ceramic
Package Reballing Challenges
Optional
Services
BGAs can be tape and reeled
Another packaging option is a matrix tray
All BEST reballed components are immediately placed into ESD safe moisture barrier bags along with a fresh desiccant after reballing. A moisture strip is included as well inside of the packaging. The bag is properly marked with critical information such as date and time of packaging. These procedures insure that the devices will be kept dry and properly protected until they are required for use. We follow the J-STD and JEDEC guidelines for packaging and have a documented process for MSD control of components.
Components in Moisture Barrier Bag