Solder

Dry Packaging

General
Process
  BGA
Handling
  StencilQuik™
Method
  EZReball™
Method
  High Volume
Method
Dry
Packaging
Ceramic
Package Reballing
Challenges
 
Optional
Services



After reballing it is important to properly package the packages in order that no damage occur to the freshly reballed parts. There are a few way in which the devices will be returned to you either in the form of the matrix tray in which you sent the parts in initially or via freshly loaded tape and reeled devices. In order to facilitate this second option we will either need your JEDEC packaging specification or a part data sheet. Generally tape and reel services add a day or two on to the lead time assuming that the package fits in to one of the “standard” tape sizes.

BGAs can be tape and reeledBGAs can be tape and reeledAnother packaging option is a matrix trayAnother packaging option is a matrix tray

All BEST reballed components are immediately placed into ESD safe moisture barrier bags along with a fresh desiccant after reballing. A moisture strip is included as well inside of the packaging. The bag is properly marked with critical information such as date and time of packaging. These procedures insure that the devices will be kept dry and properly protected until they are required for use. We follow the J-STD and JEDEC guidelines for packaging and have a documented process for MSD control of components.

Components in Moisture Barrier BagComponents in Moisture Barrier Bag