BEST soldering geeks enable electronics companies to be more effective through professional instruction, tools and taking secondary assembly projects off your plate
General
Process BGA
Handling StencilQuik™
Method EZReball™
Method High Volume
Method Dry
Packaging Ceramic
Package Reballing Challenges
Optional
Services
BEST has the capability to cost effectively provide high volume reballing services, generally when the requirement is several thousand parts of a given type at a given time.
BEST's Vanguard automated ball attach machinery is used to repeatably attach the solder balls using a tool set which can repeatably and accurately place solder balls onto a part with a controlled volume of flux on each of the pads. After reflow the devices are subject to a controlled batch reflow process followed by a cleaning process which relies on reaching a specified ionic cleanliness level prior to completion.
For high volume production BEST offers the availability of tape and reeling services and 100% optical inspection for coplanarity, pitch and ball diameter post collapse.