General
Process  BGA
Handling  StencilQuik™
Method  EZReball™
Method  High Volume
Method Dry
Packaging Ceramic
Package Reballing Challenges
 Optional
Services

High Volume BGA Reballing 

BEST has the capability to cost effectively provide high volume BGA reballing services, generally when the requirement is several thousand parts of a given type at a given time.

Reballing machinery is used to repeatably attach the solder balls using a tool set which can repeatably and accurately place solder balls onto a part with a controlled volume of flux on each of the pads. After reflow the devices are subject to a controlled batch reflow process followed by a cleaning process which relies on reaching a specified ionic cleanliness level prior to completion.

For high volume production BEST offers the availability of tape and reeling services and 100% optical inspection for coplanarity, pitch and ball diameter post collapse.