BGA Rework Systems Course




The popularity of BGA and CBGA packing has been explosive in the PCB industry over the last few years. BGAs offer better first time yields and have proven to be very reliable. Unfortunately, the cost of rework per component has increased substantially for BGAs as a result of the equipment, training and probability of damage. With the advent of lead free solder alloy balls being used in combination with or on its own this challenge has grown. The rising costs of assemblies and BGA components has led to the outsourcing for the rework of tin-lead BGAs. For those companies that want to have the capability of reworking tin-lead BGAs, BEST offers the BGA Rework Course.

This two-day course is an introduction to the BGA Rework Systems and Processes. During this course, the student is introduced to the basic operation of the equipment and its fucntions. The BGA Rework Course is a comprehensive course that encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. During the course, the student will be introduced to component identification, terms and definitions, re-balling techniques, pasting, placing and reflowing, and hands-on soldering/desoldering techniques utilizing state-of-the-art workstations. This course is structured to be in accordance with IPC-A-610, IPC-7711 and IPC-7721.

This class utilizes the following equipment for BGA Rework and Inspection:
  • SRT Summit 1500 Hot Gas Rework Machine
  • Nikon XT V 160 Electronics X-Ray Inspection Machine
  • Endoscope
Topics Covered:
  • PBGA and CBGA Component Identification
  • Reballing Techniques using EZReball™
  • Desoldering Techniques
  • Site Prep
  • Pasting using StencilQuik™
  • Component Placing
  • Reflowing
  • Plenty of Hands-on Removal and Replacement

This is a 2-day, primarily hands-on course It is a basic skills course, designed to teach selected content to beginning soldering techs. Students will demonstrate soldering skills.

Materials Provided
  • BEST Certification


  • Introduction/Course Overview
  • Introduction to Ball Grid Arrays and Mirco Grid Arryas
  • Hardware Overview
  • Safety
  • Operator Training
  • Main Screen/Options/Open Directoy Files
  • Running the Operator Training Profile (Full BGA, Perimeter BGA, Mirco BGA)
  • Insepction


  • Desoldering
  • Site Cleaning
  • Solder Paste Application - Site Stenciling (Optional)
  • Conductive Desoldering - 15 & 20 mil pitch TSOP and QFP's
  • BGA Removal/Site Prep and Replacement
Each graduate will receive a certificate of completion from BEST