Best Practices in Electronics Assembly
DESCRIPTION OF COURSE
COURSE OUTLINE
REGISTRATION CONTACT USCOURSE OVERVIEW
This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. Who Should Attend? This course is intended for Manufacturing, Process, Design, Test and Quality
This is a 2-day lecture and practical “observation” course which teaches students benchmark processes and techniques for PCB assembly.
MATERIALS PROVIDED
- SMT Assembly certificate of completion
Course Outline
DAY 1
- Optimization and Productivity
- Getting the most productivity from an existing line
- Definition of “Best Practices”
- Process Characterization
- Best Practices in the Assembly Process
- Solder Paste Printing process best practices
- Pick and Place best practices
- Reflow soldering best practices
- Wave soldering best practices
- Selective soldering best practices
- Conformal Coating best practices
- Cleaning best practices; J-STD-001 guidelines for determining cleanliness
DAY 2
- Best Practices concerning “challenging technologies”
- BTCs o Fine pitch BGAs and CSPs
- Low temperature Soldering
- Process Optimization best practices
- Data driven process design
- Practical use of Design of Experiments (DOE) in electronic manufacturing
- Practical use of Statistical Process Control (SPC) in electronics manufacturing
- Manufacturing organization best practices
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