StencilMate™ Simplifies QFN/LGA Rework

• Allows you to be able to rework devices in tight spaces
• High first pass yield with low level of voiding
• No tooling costs for new patterns
• Higher standoff distance for easier cleaning

Each evaluation kit offers the following:

• QFN sample component
• StencilMate™ stencil to match component location on PCB
• StencilMate™ stencil to match component
• Instructions

What you will need to rework a device:

• Solder paste
• Soft bristled brush to clean device post reflow
• Reflow source
• Micro squeegee (or piece of credit card)