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Reballing Preform Method

reballing-preform-method

In this technique, described in IPC 7711/21 in the 5.7.5 procedure, soldering preforms are used in order to replace solder balls. Solder preforms are single use pre-loaded preforms which are embedded in the pattern corresponding to the device to be reballed. The BEST EZReball™ preforms are custom-made and correspond to the customer-supplied drawing or the mechanical data sheet of the component. This greatly speeds the reballing process while simplifying reballing. The technique is well-suited for small to medium lot sizes.

MATERIALS REQUIRED
REBALLING PREFORM PROCESS FLOW

The process below is generic in nature and is adopted to the customer specifications, lot size and the type of component being reballed. Reballing process considerations and other analytical testing considerations can be found here. Proper mechanical handling of devices including ESD, MSD and handling of BGAs can be found here. 

  1. Incoming inspection procedures per job order, customer requirements.
  2. EZReball™ reballing preform and holding fixture engineered and fabricated
  3. Deballing process specified based on the component/customer requirements or industry specifications is completed
  4. Component inspected
  5. Component cleaned
  6. Component placed into fixture. Water soluble paste flux applied to device pads. Preform aligned to component. Solder balls swept into stencil.
  7. Reflow of solder balls based on alloy used
  8. Post ball attach monitored cleaning process based on the flux chemistry utilized to clean device
  9. Device inspected per acceptance criteria
  10. Component baked out, marked if required and packaged per customer requirements

reballing-preform-method

The solder reballing preform technique is used when a small or moderate number of the same part pattern devices need to be reballed. When the component or interposer has a large number of balls this is the preferred technique as the preforms can be preloaded and the reballing process time is reduced.