August 2014

Newsletters

August 2014

Dear Electronics Colleague:

This summer has brought some great rock shows to Chicago that I have been privileged to see: Jack White put on a 3 hour show at the iconic Chicago Theater with his "garage rock" sound. Queens of the Stone Age thundered through an older theater in Milwaukee with a wall of sound and St Vincent played an energetic set at the Pitchfork festival. I am most excited about another upcoming show that features the 80's techno sound of Devo. Can't wait to see all the devotees wearing their devo gear!

Our public speaking and teaching schedule has filled up for the fall including the following events:

SMTAI Chicago

Sunday September 28th, 2014

Advanced Rework Session on BGA/QFN/Fine pitched devices

Register for T2 here

Wednesday October 1, 2014

01005 Rework

ISFA Houston, TX

Wednesday November 12,2014

Reballing Micro Devices

CTIA Las Vegas, NV

September 9-12

Classes and demos on repairing wireless devices

We also will be exhibiting at SMTAI this year and hope to see you there!

Signature

Bob Wettermann

President, BEST Inc.

Repair of Broken PCB Corners

Before

After

When board handling or an accident occurs on a PCB, BEST can be your resource to repair a broken corner. Whether it is one board or hundreds, BEST can be that PCB repair knowledgeable resource.

Call Laura Ripoli at (847)797-9250 or email her at lripoli@solder.net to see how we can be of assistance.

Outsource Your Solder/Mfg Training Needs

If your trainer is tied up in their "other" job/s, or you have recently lost the services of a trainer, BEST can "fill in" with either a contract training resource for a few months.

Once the new trainer is identified make sure to send them to BEST to get the right start for becoming your onsite trainer.

Call Alex Conley at 01-847-797-9250 for more details.

Reballing a Leadless Device to Simplify Rework

Reworking some leadless device locations due to thermal considerations, device size and location of neighboring components is very challenging, even if you "bump" the device. BEST has an alternate solution to the replacement of these devices.

Instead of employing soldering paste and "bumping" the device, the leadless component is simply reballed and turned into a hybrid BGA. These are easier to place, can produce less voiding then other techniques and gives you the same thermal coverage.

See our article here.

We can perform this as a service, develop a process for you or manufacture the reballing devices you want.

Contact Katy Radcliff at kradcliff@solder.net or at (847) 797-9250.

Wave Power Generation to Supply "Green" Energy

LGA Rework

Do you struggle with the rework of larger LGAs, or LGAs with embedded devices internal to the package during rework?

The challenges with this type of rework include:Uneven collapse around the component causing shorts.High void percentages-especially on large ground connections.Internal parts in the package "shifting" during rework.

Find out more about our LGA rework services or speak with Laura Ripoli (lripoli@solder.net) at 847-797-9250 about your application and how BEST can solve these rework dilemmas.

Trivia Contest-August '14

The answer to last month's trivia question was correctly answered by Joe Nak of Rauland Borg who correctly identified the Lubber grasshopper, which is known as the "devil's horse". He was the only one of 40+ responses that got it!

The 1st person who replies with the correct answer will

win a phone/mp3 player speakerthat allows you to deliver full sound from your phone!!!

Question for August '14:
QUESTION:
Which material is being investigated for its high conductivity and high specific surface area to replace the current materials used in super capacitors to double their storage capacity?

The Physics of Guitar Strings