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Dear Electronics Colleague:
Late summer and early fall are great times. This year the "blood moon" made its appearance.
In addition, in celebration of being "empty nesters", my wife and I were at Oktoberfest!
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Please "save the date" for the following BEST teaching events:
October 14th: SMTA Long Island meeting on the "5 Biggest BGA Rework Challenges"
October 22nd: SMTA MN meeting on "The Challenges of Reworking Micro Devices"
December 3rd & 10th: BGA Reballing Webinar, Sign up here.
Have a great fall!
Bob Wettermann
President, BEST Inc.
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J-STD-001 and Gold Embrittlement
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Gold embrittlement and voiding appears in SMT solder joints when using gold-finished components. This means that over time the components are not as reliable in terms of their mechanical bond strength to the PCB. Components at some point and under the right conditions, can fall off the PCB.
Gold embrittlement in solder joints show up when a percentage ratio of the weight of the gold versus the weight of the solder is 3% of the total weight of the solder alloy. (Recent findings indicate that gold embrittlement can occur at even lower percentages!)
The latest "F" version of the J-STD-001 has some MAJOR CHANGES impacting not only the traditional companies assembling Class II assemblies but also the tradtionally impacted CLASS III assemblies.
There are some MAJOR CHANGES in this latest standard which will impact you. See more about these changes here or call Dan Patten (dpatten@solder.net) at BEST Inc.
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BEST and Lead Tinning Services
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BEST Inc.has the expertise to guide you through the component lead tinning process. If you have gold components which need to have their leads tinned and you are not happy with a 4-6 week lead time (ours are 2 weeks in most cases for lead tinning), call BEST Inc.
Furthermore, if you require someone to help you with your component solder-ability issues, we are here to diagnose and troubleshoot the problem.
Call Dan Patten at (847) 797-9250 for more information or send a request for quotation to dpatten@solder.net.
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StencilQuik(TM) Now Available in
4, 6 and 8 mil Thicknesses
The StencilQuik(TM) stencil system comes in handy for either placing BGAs and other area devices by hand, repairing solder mask, or overcoming warped packages.
The StencilQuik(TM) product has been designed and manufactured by BEST Inc. for 8+ years. We are pleased to announce the addition of a 6 mil version. More information on this product can be found here. The unique aspect of these BGA repair stencils is that the adhesive and the material can survive reflow cycles. To order, go here.
Call Chris E. today at (847)797-9250 for more product information or send her mail at cedwards@solder.net.
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Trivia Contest
October 2015
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There are only 3 more trivia questions to qualify for the light saber drawing at the end of the year in coordination with the expected release date of the movie.
In anticipation of the new Star Wars movie (see latest trailer from the Force Awakens here) being released, we will continue to offer Star Wars prizes for all of the monthly winners this year. At the end of the year, all winners (right answer within (1) day of the question coming out, not just that months' winner) will be eligible to win a working light saber.
Question for October 2015:
The actor who played Chebecca during the original shooting of the Star Wars movies had what profession at the time?
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Best Inc. | 847-797-9250
Email | Website
3603 Edison Place
Rolling Meadows, IL 60008
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