February 2014


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Feb 2014


Dear Electronics Colleague:

February has been a great month with the Olympics and other adventures. Our family had the opportunity to visit a local 50m ski jump (what in Illinois?!) to see some of the regional competitors.  It included kids jumping since they were 5 years of age. In addition, we had the opportunity to go night snorkeling with Manta Rays having  a 14ft wing span while in Kona, Hawaii.

BEST staff and outside SMEs are in the midst of planning for our April 3rd X-Ray Workshop.  It will feature Bob Klenke and Ken Gribble-both industry veterans, and long time speakers on X-Ray and other SMT topics. Contact to get one of the slots left. 

Wishing a Healthy and Successful New Year!  


Bob Wettermann

President, BEST Inc.

Follow me on  Twitter now at @bwetman 


Rework of Bare Boards  

  Before Ablation                             Before                               Solder Mask Ablated

BEST and Additive Circuits (NH) are combining their collective expertise to bring you the capability for bare board rework. If you need to have traces cut, pads added, solder mask ablated, boards machined to exacting specs or conductors added; then BEST can be your source. We can quickly modify existing boards eliminating the wait on a board re-spin, and scrap out of many existing boards that are unusable.  

BEST brings technology in highly precise laser cutting and ablation, while Additive Circuits has proven technology in conductor modification that allows for subsequent SMT assembly processes to be completed to the PCB.   

Call Laura Ripoli at (847)797-9250 or email her your modified GERBER files at to see how we can be of service.

BEST Develops Tools for EZReball(TM) Preforms 



BEST has developed a few more useful tools to make your job of reballing simpler and faster.

Firstly, a pair of "square off" angles help to align the preform and the device. Unlike other devices they do not impact the thermal mass of the assembly. Simply square the preform to the device on opposite corners, remove and then place the device/preform "sandwich" on a plate of ceramic or glass and reflow.

Secondly, BEST Inc can configure a weight for the preform when the warpage of the BGA/CSP or WLP is distorted.  

Contact Katy Radcliff at or call (847) 797-9250 if you want to make your reballing simpler and faster with these tools!
More from Video Series on QFNs from Technical Symposium 
Cleaning Underneath QFNs and LGAs
Cleaning Underneath QFNs and LGAs
Check out the videos on our YouTube channel -Solderinggeek- from the recent BEST symposium on bottom terminated components. There is a series of (5) sessions featuring Q/A at the end of the session. 
Find this video and more on the BEST YouTube channel  
We can be the Referee
New IPC-A-630 Specification for Electronic Enclosures

Trivia Contest-Feb'14


BEST to Train Using Robotic Instructors Beginning in 2017

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