|BGA Rework Using StikNPeel(TM) Stencil
From ultra fine-pitched BGA rework of 0.4mm pitch and 10mm package sizes to QFP rework down to 0.35mm pitch devices StikNPeel(TM) rework stencils make reworking your products simpler.
These stencils are made to order in 4,5 and 6 mil thicknesses with each pattern to order snd can be delivered in as little as 24-48 hrs.
More information on StikNPeel(TM) stencils can be found here
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