November 2019


November 2019
Dear Electronics Colleague -
We wish you and families a relaxing and enjoyable time during the Thanksgiving break.

All the BEST,

Dan Patten
Deballing/Reballing Options

BEST Inc has been performing reballing services for customers for over 20 years. We build many of the tools for custom reballing patterns within our shop thereby reducing the lead time required. In addition, our skilled BGA rework technicians know how to handle devices from 10 mils solder ball sizes up to 40 mils on packages from 5 x 5mm to 55 x 55 mm packages.
We offer a variety of processes and services with respect to BGA/CSP and other device reballing. Read on below to get into BGA reballing options
More information on BGA reballing can be found here or call Laura Ripoli @ 847-797-9250.
BEST Welcomes Kris Roberson to Expanding Instructor Staff
Kris Roberson
We are pleased to welcome Kri s Roberson to the BEST solder training staff. Kris brings with him a deep knowledge of the IPC standards and how they were developed as well as highly-tuned soldering skills and a pleasant and fun teaching style. Kris will be teaching, consulting and developing solder training resources for BEST.
Besides his 20 plus years of instruction Kris is a father of (6), has grandkids, lives in a haunted house and enjoys singing and acting in his spare time.
StikNPeel(TM)  Rework Stencils-Simplifies Rework
BGA Rework Using StikNPeel(TM) Stencil
BGA Rework Using StikNPeel(TM) Stencil
From ultra fine-pitched BGA rework of 0.4mm pitch and 10mm package sizes to QFP rework down to 0.35mm pitch devices StikNPeel(TM) rework stencils make reworking your products simpler.
These stencils are made to order in 4,5 and 6 mil thicknesses with each pattern to order snd can be delivered in as little as 24-48 hrs.
More information on StikNPeel(TM) stencils can be found here. Call Chris Edwards if you have a specific application or send her mail at