January 2019


January 2019
Dear Electronics Colleague -
Happy New Year!
We sure hit the ground running after a nice little break and greatly appreciate all of you for making that possible. As we gear up for APEX in San Diego, we invite you to the following sessions:
Advanced Rework: BGA Reballing and Leadless Devices - Part 1
Date:   Sunday, January 27, 2019
           9:00am - 12:00pm
Advanced Rework: BGA Reballing and Leadless Devices - Part 2
Date:   Sunday, January 27, 2019
           2:00pm - 5:00pm
Presenters: Norman Mier, MIT, Senior Tech. Trainer;  Jodi Johnson, MIT
More info on APEX tech. sessions here.

Wishing a healthy and successful New Year!
Best Regards,
Dan Patten 
Course Highlight -
IPC/WHMA-A-620Requirements and Acceptance for Cable and Wire Harness Assemblies,  has become the most important process, materials, and inspections standard for the cable and wire harness industry. Developed with support from the Wire Harness Manufacturers' Association, the document and training has earned an international reputation as the source for end-product acceptance.

The IPC/WHMA-A-620 Certified IPC Trainer (CIT) certification prepares individuals to deliver Certified IPC Specialist (CIS) training and helps enhance employee skills and performance. Additionally, certification demonstrates your commitment to continuous improvement of product quality and reliability, and greatly facilitates certification to ISO or other quality assurance initiatives.
Upcoming Courses:
February 19 - 22, 2019 
@ Detroit, MI location
March 18 - 21, 2019 
@ Chicago, IL location
If you have any questions or are interested in pricing information, contact Alex Conley at 224-387-3256.
BGA Reballing - Webinar
BEST is teaming up with SMTA to offer a webinar on "BGA Reballing - Theory and Hands-on." This webinar is a "how to" guide for BGA reballing intended for PCB rework and repair depots, as well as device reclaimers.
The first half of the webinar will cover the need for reballing of BGAs, CSPs and other devices. The second half will focus on the equipment set recommended for reballing and the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach. Other topics include: inspection of the reballed components, the type of reliability testing data currently available, and ideas for developing your own specifications.

This webinar is designed for process engineers, rework technicians, and others interested in repairing electronics.
Date:  February 19th, 2019
        12:00pm - 1:30pm CST
Price:  $25 member /
           $95 non-member
Instructor Bio:
Bob Wettermann is the owner of BEST Inc. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

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