BEST is teaming up with SMTA to offer a webinar on "BGA Reballing - Theory and Hands-on." This webinar is a "how to" guide for BGA reballing intended for PCB rework and repair depots, as well as device reclaimers.
The first half of the webinar will cover the need for reballing of BGAs, CSPs and other devices. The second half will focus on the equipment set recommended for reballing and the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach. Other topics include: inspection of the reballed components, the type of reliability testing data currently available, and ideas for developing your own specifications.
This webinar is designed for process engineers, rework technicians, and others interested in repairing electronics.
Date: February 19th, 2019
Bob Wettermann is the owner of BEST Inc. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
