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Top 4 Things You Didn’t Know About BGA Reballing

Top 4 Things You Didn’t Know About BGA Reballing

Posted by Admin on Sep 7th 2021

Are you a small-scale electronic enterprise owner based out of Chicago? Do you repair laptops, tablets, mobile phones, and other portable electronic devices? Are you incurring high overhead costs for bringing these electronics back into normal working conditions? Then, we have got an excellent solution for you that will reduce your expenses on hiring expert technicians and sourcing the expensive parts. All you need to do is outsource your PCB repair/rework tasks for various electronics to specialized companies.

The leading PCB repair/rework companies can help you with board damage repairs, SMD components replacement, and BGA reballing<https://www.solder.net/products/ezreball>. Do you know what BGA reballing is? Let’s see four crucial things you need to know about BGA reballing:

1. What is a BGA?

BGA stands for Ball Grid Array, i.e., a surface-mount packaging developed for mounting necessary devices on the printed circuit boards such as microprocessors. It is one of the latest techniques to mount a BGA chip over PCBs to establish multiple connections and ensure a seamless flow of the electric current in the electronic assemblies.

2. Why do engineers design circuit boards with BGA?

An instrumental advantage of using BGA instead of other board designs is that they are highly durable and long-lasting. It makes them a suitable electronic items requiring high-performance and industrial equipment ranging from aerospace and telecommunication to the military and OEM industries.

3. What creates problems in BGAs?

Though BGA has gained ground to be a durable surface-mount packaging, there are chances for it to fail. How? The connection between a BGA chip and the printed circuit boards can loosen due to the extended use of the product related to the thermal cycling of the device being powered and unpowered. Apart from this, harsh environmental conditions like dust or moisture can also affect its performance.

4. What problems could BGAs lead to in electronic components?

If loose connections or solder bridging occurs in the BGA systems, chances are high your customer’s smartphones, tablets, or portable computers could develop display-related issues or go dead altogether. Besides this, you may also notice unreliable performance in the given electronic devices if their BGA becomes faulty.