Top 4 Things You Didn’t Know About BGA Reballing

Sep 21st 2021

BGA stands for Ball Grid Array, i.e., a surface-mount packaging developed specifically to mount necessary devices on printed circuit boards such as microprocessors. It has been one of the latest techniques to establish multiple connections and ensure that electric currents flow smoothly throughout electronic assemblies with no interference caused by physical contact between components.

BGA Reballing is a process that involves the removal of parts from an item to be reused. BGA boards are used in many different industries, especially those that require high-performance and industrial equipment. They're durable enough to withstand the most demanding environments like aerospace or telecommunication systems and military situations; they also make for great OEMs because these things have been holding up so well with time.

Are you a small-scale electronic enterprise owner based out of Chicago? Do you repair laptops, tablets, mobile phones, and other portable electronic devices? Are you incurring high over- head costs for bringing these electronics back into normal working conditions? Then, we have got an excellent solution for you that will reduce your expenses on hiring expert technicians and sourcing the expensive parts. All you need to do is out source your PCB repair/rework tasks for various electronics to specialized companies.