BGA (Ball Grid Array) chips have become increasingly popular in modern electronics due to their compact size and high-performance capabilities. As a result, a wide range of devices, such as smartphones, laptops, gaming consoles, and many other electronic products, commonly use these chips.
One reason for its popularity is its ability to pack many pins into a small space, resulting in higher density and performance. This ability makes them ideal for use in small electronic devices where an area is at a premium.
BGA reballing is a process that involves removing an existing BGA chip from a printed circuit board and replacing it with a new one. This process is often used in electronic repair to fix faulty BGA chips or upgrade a device's performance.
The reballing of BGA chips requires precision and expertise to ensure that the new chip is appropriately aligned and secured in place. However, it can be a highly effective way to repair or upgrade electronic devices that use BGA chips with the right tools and techniques.