EZReball™ Fast, simple reballing method

• Fast process
• High first pass yield
• No tooling costs for new patterns
• Simple process

Each evaluation kit offers the following:

• BGA sample component
• EZReball™ preform to match component location on PCB
• Instructions

What you will need to place a device:

• Paste flux
• Cleaning solution based on flux used
• Reflow source
• Inspection optics