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Visual inspection of 100% of the BGA joints is not possible on area array devices. However there are two techniques, which if used in combination with one another, can greatly reduce the amount of defects which "pass" BGA rework inspection. With a combination of both transmissive XRAY and endoscopic inspection, very few defects of BGA rework cannot be identified.
Transmissive XRAY can be used to document several potential defects. Solder bridges are the most common defect which can be detected by this technique. Gross voids can be seen at greater power and magnification levels. However XRAY has limited ability to detect opens.
A strong supplemental tool to XRAY, an endoscopic inspection tool, allows hidden solder joints or joints that are in close proximity to other nearby parts to be inspected and characterized. The ability to "see" whether the reflow process delivers a defective or a target joint condition can be accomplished with this inspection tool. One of the major benefits of using an endoscope is its ability to "see" underneath the grid array and the surface of the individual solder balls. Clues to the quality of joints including its texture, uniformity, smoothness, color and brightness and surface characteristics can be documented with this tool. A poor solder joint with micro cracks on its surface could be "seen" with the endoscopic inspection tool while not showing up on XRAY
Yields for reworked BGAs have been established at greater than 95%. SIR testing has shown that reworked components can have the same surface insulation resistance. When using the StencilQuik™ rework process SIR testing has shown an increase in surface resistance value by a factor of ten. Testing has shown that properly reworked BGAs joints exhibit the same resistance to thermal fatigue as product that has gone through initial assembly.
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