Reballing of devices with solder balls, alloy conversions and more
Robotic hot solder dip for RoHS compliance, MIL, curing poor wettability
BEST now only performs rework at the board level, but also at the device level. Reballing of area array devices whether they be plastic-, metal- or ceramic-bodied components can be competed in lot sizes from one piece to tens of thousands. BEST offers a variety of optional services to go along with reballing including but not limited to special marking (including laser marking), places the components back on to tape and reel, specialty cleaning and a variety of QA measurement for each reballed component.
BEST robotic hot solder dip services allows for a new alloy to be deposited on to the leads of parts. If you have a solderability problem on older components or nead a new alloy on the component lead or even need to meet the newer requirements of the J-STD-001 in terms of the gold mitigation BEST can be your source for the retinning of components. We have the ability to turn parts around quickly and to a high quality level.
Whether it is a single device or tens of thousands BEST has the process for your reballing needs and requirements. We can provide a variety of different solder alloys even beyond the typical SAC and SnPb configurations.
BEST offers robotic hot solder dip services. Whether you are trying to meet the J-STD-001 requires, change the alloy of the lead or increase the wettability of the lead in the soldering process we can accommodate your needs.