StencilQuik™ BGA Stencils
StencilQuik™, previously honored with the coveted Vison Award for Product of the Year under the Rework Products category, is now a standard procedure in IPC 7711 5.7.2
Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in and around the BGA area being reworked? Do want to insure that a reliable rework process is used that subjects the BGA to a minimal number of heat excusions? We have an answer to your frustrations------ StencilQuik™. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
Whether you are using paste flux or solder paste StencilQuik™ greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs.
These flexible solder paste stencils remain in place on the site location becoming an integral part of the PCB assembly. StencilQuik™ is manufactured from a polyimide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process. These stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
StencilQuik™s are packaged in groups of (10) in a small antistatic poly bag. They are NOW available in 4,6 and 8 mil thicknesses with an electronics grade adhesive. Squeegees are sold separately.
StencilQuik™ Patent Pending, BEST Inc.
StencilQuik™ A faster more reliable rework process