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 BEST provides sound solutions for BGA and other grid array device rework. Our engineers have developed better processes to make BGA rework more repeatable, consistent and reliable. We have been reworking BGAs since their inception, and continue to stay current with the latest package styles and techniques to rework them.
We have just about every "high end" piece of rework equipment currently available and always have the right tool for the job. Every project is is performed by IPC Certified Technicians who have been specifically trained for BGA rework and X-ray verification. Each job is returned to you with a disc of the appropriate x-ray
images.
Repair of damaged solder mask between BGA pads and
connecting vias is a critical step to prevent solder from flowing down the vias
during BGA replacement. Damaged or missing BGA pads are replaced by following an
IPC recommended procedure. This procedure uses specially fabricated adhesive
backed BGA pads that are bonded to the board surface.
Lifted solder pad needs to be repaired prior to
replacement.
When your design requires a changes or modification at a BGA site, using a
standard jumper wire is normally not an option. Jumper wires are simply too
large to fit under a BGA component. This modification procedure uses flat copper
ribbon thin enough to fit safely under the BGA component. This will BGA repair
will save you from doing another board build.
BEST provides services including BGA component removal, site prep, replacement,
salvage, x-ray or optical verification, circuit design changes, as well as pad,
trace and mask repair.
Our IPC Master Certification Center also offers
certification classes in BGA rework and technical support.
Let our experience work for you!
Contact B.E.S.T. Today!
Place Order for BGA Services
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