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BEST offers high-reliability, cost-effective BGA reballing services featuring its patented EZReball™ preforms to restore all of your BGA's to their original specifications or change the alloy of your BGAs..
BGA packages can typically have solder ball-attach problems due to manufacturing defects, improper end-user handling or PCB reclaim processes. Since these BGA packages can be expensive to discard or replace, there has is demand for rework services or "Reballing" of the BGA package to restore it to Industry standard IPC or JEDEC specifications. 
BEST has the capabilities of handling most of today's BGA package sizes and ball counts. We utilize a highly reliable, repeatable, industry-wide proven process in compliance with IPC and JEDEC specs. BEST can deal with both small to large production volumes to meet your requirements.
Having been involved with device testing and specification review or writing, BEST engineering can consult with you on a reballing process or process specification. We can review your processing requirements including cleanliness testing, MSD handling or profile or acceptance criteria development BEST is your reballing technical resource. We can also review your testing requirements including cleanliness, ball shear of acoustic microscopy testing.
Recently a large medical device OEM came to BEST for guidance and advice on a reballing process specification. The component manufacturer had discntinued the device in a given alloy. This manufacturer had never been involved in reballing and came to BEST looking for guidance. We were able to work with them and guide them through process definition, qualification for manufacturing and work with them to develop a repeatable process for their critical application.
To learn more details about the BEST standard reballing process, please see our technical pages.
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