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BEST offers high-reliability, cost-effective reballing services to restore all of your BGA's to their original specifications.
BGA packages can typically have solder ball-attach problems due to manufacturing defects, improper end-user handling or PCB reclaim processes. Since these BGA packages can be expensive to discard or replace, there has been an increasing demand for rework services or "Reballing" of the BGA package to restore it to Industry standard IPC or JEDEC specifications.
BEST has the capabilities of handling most of today's BGA package sizes and ball counts. We utilize a highly reliable, repeatable, industry-wide proven process in compliance with IPC and JEDEC specs. BEST can deal with both small to large production volumes to meet your requirements.
To learn more details about the BEST reballing process, please see our
technical pages.
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