Pad Repair and Circuit Trace Repair
Surface Mount Pad and Circuit Trace Repair
If surface mount or BGA pads or circuit traces have been damaged due to improper part removal techniques or mechanical "digging" into the circuit board, then BEST can repair these damaged circuit patterns to as a "good as new" condition. If a critical area array device needs to have its pads and or traces repaired prior to reballing then BEST can repair these pads and traces.
BEST stocks many different kinds and styles of pads and traces in order to facilitate a fast turnaround of the repair. We even have the ability to make custom traces and pads in order to reduce the time and cost it takes to repair those boards which have the need for the same repair many times over.
BEST technicians use a variety of different IPC repair techniques along with the "tricks of the trade" they have learned over many years. This enables them to accomplish high quality repairs where only a trained eye could discern that a repair had been performed.
BEST testing has shown by using both backside micro etched circuit frames (a BEST standard) and the BEST 2-part electronics adhesive system that the bond strength of repair traces, pads and lands can approach that of the original lands, pads and traces. Even under thermal air-air shock conditions from -50C to 85C at a 30 minute dwell time over 200 cycles this adhesive system performed well.
In a study summarizing a variety of adhesion techniques for the repair of printed circuit board traces, the 2 part resin-hardner epoxy system has been shown to yield the best results. Furthermore, another study demonstrated that the epoxy method yielded a greater part-pad shear strengths -