BGA X-Ray Inspection
BEST's BGA x-ray capabilities, like the rest of its BGA service offerings, is extensive. BEST can be your outsourced BGA x-ray inspection partner for BGA and stacked packages. If you are assembling these packages onto boards but do not have internal x-ray capabilities then consider outsourcing this to BEST until the time comes when you can spend the capital for bringing this capability in-house. After programming your board into our x-ray system we can automate the follow-on steps for subsequent BGA inspection making the time and cost lower over time.
For the in-depth analysis of BGAs the BEST x-ray inspection system can give you the following BGA inspection capabilities:
- Void detection and percentage calculation
- Pitch determination
- Circularity of reflowed solder balls
- Ball diameter analysis post reflow
- Short circuit analysis
- Wetting to the pad analysis
- Wire bond analysis
So whether you are looking to have your BGAs from manufacturing x-ray analyzed or dig deep into a root cause of BGA manufacturing issues you are expressing, BEST can be your outsourced BGA x-ray inspection provider.
We can get you crisp images of every single location along with the reference designator or even a movie as we "drive around" the BGA to show you the anomalies noted by the x-ray technician. CSPs, BGAs, and POPs can be x-ray inspected by the BEST technicians. Large thermal mass boards (160KV plate voltage)with tiny feature sets (3um spot size) are not a problem for our x-ray system. Micro BGA x-ray inspection, as well as column grid array packages, can be x-ray inspected using our x-ray system. A full report, partial report, images fully or partially annotated x-ray analysis can be done by our BGA technicians as they are highly skilled at shooting images as this inspection is part of standard BGA rework process.
Call BEST today to see how we might be able to be of service for your BGA x-ray inspection or BGA x-ray screening requirements.