BGA inspection is a critical process in electronics manufacturing to ensure the reliability and quality of Ball Grid Array (BGA) components. It involves assessing the solder connections of these complex packages, which can be challenging due to their hidden nature beneath the element.

Visual BGA inspection is one of the primary methods employed, where skilled technicians use specialized equipment like magnifying lenses, microscopes, and cameras to inspect the solder joints for any defects or anomalies visually. This meticulous inspection helps identify issues such as solder ball voiding, misalignment, or insufficient soldering, ensuring electronic devices' overall functionality and durability.