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BEST soldering geeks enable electronics companies to be more effective through professional instruction, tools and taking secondary assembly projects off your plate
BEST soldering geeks enable electronics companies to be more effective through professional instruction, tools and taking secondary assembly projects off your plate
Successful rework and assembly methods have been developed with lead-free solders for all types of components. During the transition period to lead-free manufacturing rework practices have to be developed that deal with the issues related to handling, reworking, tracking and inspecting lead free PCB assemblies.
A strong supplemental tool to XRAY, a boroscopic inspection tool, allows hidden solder joint or joints that are in close proximity to other nearby parts to be inspected and characterized. BEST has the capability to inspect and troubleshoot process defects through the use of this tool.
XRAY imaging is a widely utilized analytical tool for the SMT PCB manufacturing process. In PCB assembly area array packages such as CGA, BGAs and CSPs with their concealed solder joints, have become the main field of application for X-ray inspection.
As the complexity of electronic assemblies has increased and the corresponding miniaturization of components populating those assemblies have shrunk.
BEST IPC Master Instructors have put together hands-on demo videos for common soldering practices.
If you have a question or seek advice send in your questions and a BEST subject matter expert on training, PCB rework and repair or electronics assembly will reply.
The following describes the general BGA rework process covering the development and criteria for establishing profiles for BGA removal and replacement.
The following describes the general BGA rework process covering the development and criteria for establishing profiles for BGA removal and replacement.
See the various processes for reballing 1-2 devices, low volume and high volume using an automated machine below
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