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Overview Benefits FAQs Articles Instructions StencilQuik™

stencilquik step1StencilQuik™ allows you to rework a BGA even in tight spaces not accommodated with a metal stencil.stencilquik step2StencilQuik™ eliminates the hassle of cleaning stencils.

 

stencilquik step3StencilQuik™ eliminates hours of tedious mask repairs underneath BGAs.stencilquik step4StencilQuik™ eliminates multiple paste print operations due to dirty stencils. Eliminate hours of solder mask damage repair time for BGA sites while improving rework yield.

StencilQuik™ serves as both your stencil and alignment device. As an added bonus the stencil acts as an insulator between interconnects preventing shorts between balls thereby increasing the reliability of the reworked device. The benefits of StencilQuik™ process are many:

  • Eliminates "smearing" of the solder paste print pattern as the StencilQuik™ never gets lifted off the PCB
  • Provides the lowest cost method for area array device placement as stencil cleaning costs are eliminated, scrap due to improper device placement is greatly reduced and the time required to align and place a device is cut significantly
  • Allows you to rework area array devices in very "tight" areas on the PCB that are not possible with a metal stencil
  • Allows you to rework area array devices with solder resist irregularities. The StencilQuik™ acts as a mask for damaged solder mask areas underneath a BGA. This eliminates the time required to tediously repair damaged mask while preventing "shorting" between balls
  • StencilQuik™ allows you to rework area array devices on warped boards as the stencil is held in intimate contact with the PCB when the solder paste or flux is applied.
  • StencilQuik™ features a built-in spacer which prevents excessive solder paste collapse and provides a minimum stand off height between the area array device and the PCB
  • StencilQuik™ acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
  • StencilQuik™allows you to more quickly and correctly align a high lead count leaded SMT component increasing rework throughput
  • Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™.
  • Allows you to replace your own BGAs or CSPs-without special training or large capital equipment expenditures

play buttonSee how StencilQuik™ can simplify BGA rework

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Order your FREE StencilQuik™ evaluation kit here

StencilQuik™ Patent Pending, BEST Inc.

 

Overview

Overview Benefits FAQs Articles Instructions StencilQuik™ Request your evalutation kit

BGA rework stencil kits, a quality solder paste stencil solution.BGA rework stencil kits, a quality solder paste stencil solution.Search Catalog Place OrderSearch Catalog Place OrderEliminate hours of solder mask damage repair time for bga sites while improving rework yield. 

Vision Award - Product of the YearVision Award - Product of the YearStencilQuik™ has been honored with the coveted Vision Award for 2004 Product of the Year under the Rework Products category.

Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in and around the BGA area being reworked? Do want to insure that a reliable rework process is used that subjects the BGA to a minimal number of heat excusions? We have an answer to your frustrations------ StencilQuik™. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.

Whether you are using paste flux or solder paste StencilQuik™ greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs.

These flexible solder paste stencils remain in place on the site location becoming an integral part of the PCB assembly. StencilQuik™ is manufactured from a polyimide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process. These stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied. 

PLCC

See how StencilQuik™
can simplify
BGA rework.

PLCC

See how StencilQuik™
can simplify
PLCC rework.
 

StencilQuik™s are packaged in groups of (10) in a small antistatic poly bag. Squeegees are sold separately.

Order your FREE StencilQuik™ evaluation kit here

StencilQuik™ Patent Pending, BEST Inc.

StencilQuik™ A faster more reliable rework process

bga rework mini-micro smt stencil solutions1. Prepare site.Paste flux or solder paste stencil kits2. Align and affix the StencilQuik onto the PCB.metal stencils, solder paste stencils, bga stencils, mini stencils, micro stencils.3. Squeege paste or apply flux into the apertures on the RCB.stencil quik, stencilquik, StencilQuik, flextec stencils4. Simply align and place part and reflow.

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