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In Solder Rework/Repair, Solder Training and Tools

EDFA eNews / October 24th 2013

Overview Benefits FAQ Datasheets Instructions

Are you tired of the existing reballing methods being in the hands of process experts due to the complexities and the dexterity required?

ARE YOU LOOKING FOR A FASTER REBALLING METHOD?

The new BEST EZReball™ process is an answer to your reballing problems.

This unique method simplifies the reballing process allowing for better yields and faster reballing times.

Reballing KitsReballing KitsThe simple nature of the EZReball™ reballing process allows even the beginning repair technician to reliably and quickly replace balls on a BGA package. Alignment is simple with the edges of the preform being “squared up” with the sides of the package thereby eliminating the need to buy custom fixtures or frames. The adhesive is engineered such that the balls are firmly held in place until after reflow thereby reducing the problem of missing solder balls found in other techniques. After the device has been reflowed, the preform is simply peeled off, eliminating the time required in cleaning off residual paper used in other methods.

The EZReball™ preforms are packaged and delivered to you the way you want. Preforms are custom made to your exact alloy and device array requirements without expensive tooling. They are also packaged such that developers and those building PCB prototypes can use them in quantities that are more reasonable.

These reballing preforms are a simple, elegant and easy-to-use reballing system. EZReball™ preforms are manufactured to your exacting specifications from a specialty high temperature-rated film which aligns the balls. The balls are aligned through these apertures and held in place using an engineered adhesive system. The preform is cut using a laser to your exacting device requirements. Solder balls are captured and retained by the preform and are aligned to the prepped device and reflowed. After reflow the preform is simply peeled away. EZReball™ reballing preforms are packaged in groups of (15) in a small antistatic bag. Each packet also consists of (1) repair reballing preform which gives the user a QC tool to inspect that the reballed device and to simplify the rework if a single ball needed to be reworked.

EZREBALL™ SPEEDS DEVICE REBALLING DOWN TO 0.35MM PITCH!

bga rework mini-micro smt stencil solutions1. Dress Site and CleanPaste flux or solder paste stencil kits2. Apply Paste Flux

metal stencils, solder paste stencils, bga stencils, mini stencils, micro stencils.3. Align and Place BGA on to Preformstencil quik, stencilquik, StencilQuik, flextec stencils4. Post Reflow and Preform Removal

Contact Us

Please use the information below to send us your feedback.

If you would like:

  1. To send us a print or photo or other file along with your service (PCB rework, PCB repair, PCB test/troubleshooting) inquiry you can attach this file.
  2. Attach a mechanical data sheet for your rework stencil or reballing preform you can attach this file.

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WHAT'S NEW?

ARTICLE: A Look Into PCB Rework and Repair

ARTICLE: IPC-A-620 Gets a Facelift

 

 

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