Lead-Free SMT Training

Name: Lead-Free SMT
Delivery Method: LAN or Web                  
Students

These lead-free rework modules are intended for process technicians, supervisors and process engineers responsible for the SMT assembly process.

Objectives

Participants successfully completing the course are able to identify and explain:
• Impact of lead-free materials on the SMT reflow soldering process
• Solder paste specifications and materials considerations
• Reliability, acceptance criteria, cosmetics
• Flux specifications, no-clean fluxes, high solids, water based
• PCBs, surface finish, component lead-finish and packaging, DFM
• Temperature compatibility, Moisture Sensitivity
• Solder joint defects in reflow
• Screen printing alignment, errors, maintenance, stencil design
• Placement accuracy, self–alignment, preventive maintenance
• Process window, heat transfer, heat types, profiles, cooling
• Benefits and indicators for the use of Nitrogen
• Profiling for lead-free, measurement techniques
• Designing experiments, Taguchi orthogonal variable arrays
• Pre-heat, reflow, cool down, use of indicator labels, thermocouples
• Thermal mass and profile, interaction with conveyor speed
• Peak temperature, delta T and TAL
• Cleaning after soldering, cosmetics, ionic residues, inspection standards
• Automated optical, x-ray inspection
• Process monitoring, SMT soldering problems, corrective action
 

Qualification and Certification Testing

This training interactive learning module constantly checks whether or not the student is learning. At the end of the module the successful student is awarded a certificate. A criterion-referenced test with feedback and a response to each question is given.

Estimated Duration

1-1.5 hours
 

Click here to order

For more information about our on-line learning:

Lead-free soldering orientation course outline
Lead-free rework course outline

LAN-based training
Web-based training