SMT “Boot Camp” Class

DAY 1

• Introduction
• PCB Fab Process Overview
• Circuit board manufacture
  1. Circuit board manufacture
  2. General information
  3. Customer Data
  4. Layer manufacturing
  5. Layer perforation
  6. Layer lamination
  7. Copper plating
  8. Surface finish
  9. Legend
  10. Separation
  11. Testing
• Solder paste
1. Nomenclature
2. Manufacture
3. Solder characteristics
4. J-STD-006
5. Flux
6. J-STD-004
• Stencil Fabrication

DAY 2

• Screen Printing
1. Dispensing options
2. Fiducials
3. Solder Brick formation
4. Squeegee speed
5. Snap-off
• Adhesive application
1. Dispensing Options
2. Stencil Design
3. Dot placement
• Component placement
  1. Gantry machines
  2. Turret machine
  3. Combination machine
  4. PCB handling
  5. Programming
  6. Machine selection

DAY 3

• Reflow
1. Oven types
2. Profile development
3. Profile Maintenance
• Wave
1. Oven types
2. Profile development

DAY 4

• Cleaning
1. Contaminants and Corresponding Solvents
2. Effectiveness of Aqueous Detergents
3. Cleaning Equipment (Batch and in-line systems)
4. Cleanability of Components
5. Driving Forces For No Clean
• Testing
  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. AOI
  4. XRAY
• Electrical testing-flying probe vs bead-of-nails