Rework of Leadless Devices

The popularity of leadless devices such as QFNs, LGAs and LCC grown trendmendously over the last few years as overall end device sizes have shrunk (particularly in the handheld device area) has grown as their overall depth, excellent heat dissipation for their size has driven this trend. Unfortunately, the cost of rework per component has increased substantially for these device types as their very small size have made their rework difficult. For those companies that want to have the capability of reworking small, lead free or tin-lead leadless devices, BEST offers the Leadless Device Rework Certification.

The leadless device rework course is comprehensive and employs the skills necessary to perform rework of electronic printed circuit boards to include QFN, LGA, LCC and other leadless device technologies. During the course, the student will be introduced to component identification, terms and definitions, re-bumping techniques, pasting, placing and reflowing, and hands-on soldering/desoldering techniques utilizing state-of-the-art workstations. This course is structured to be in accordance with IPC-A-610, IPC-7091. IPC-7711 and IPC-7721.

This class utilizes the following equipment for Leadless Device Rework and Inspection:

• SRT Summit 1500 Hot Gas Rework Machine
• OK Industries BGA APR5000 Rework Machine
• Nicolet NXR 1650-I X-ray Inspection Station
• Endoscope
• Leadless Component Identification
• Rebumping Technique using StencilMate™
• Desoldering Techniques
• Site Prep
• Component Placement
• Reflowing
• Hands-on Removal and Replacement

This is a 1-day, primarily hands-on course It is a more advanced skills course, designed to teach selected content to beginning soldering techs. Students will demonstrate soldering skills.

Each candidate who successfully completes the instructor training and examination will receive the following materials to conduct further operator training:

• BEST Certification