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Gamer, Laptop, Smart Phone - Reballing Course

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PS3 Chip ReballingPS3 Chip ReballingThis class is for those companies repairing video game consoles, laptops, and smart phones who wish to learn how to re-attach solder balls to packages. This is required when the same device taken off from the PCB needs to be reballed prior to being placed and reflowed back on to the PCB.

This is a comprehensive course that teaches you and up to 4 technicians the skills you need to re-attach solder balls to a variety of packages. Prior to the holding of the class, we ask that you send in your patterns so your exact packages can be matched up to the correct preforms and used as demonstrations in the class. This means you will be reballing your devices, whether it is the GPU, CPU or other chip sets. During the course, the student will be introduced to component handling, profiling, device preparation, cleaning/inspection, and the reballing process. In addition, process troubleshooting of devices will be discussed. When you leave this class, you will have a subject matter expert to call on when you get into a difficult reballing challenge. This course is structured to be in accordance with IPC-A-610, IPC-7711 and IPC-7721

NOTE: This class does NOT teach you about the rework process (SEE BGA Rework Course)

This class utilizes the following equipment for BGA reballing and inspection (We can also use your equipment, assuming that you know how to operate it):

  • SRT Summit 1500 Hot Gas Rework Machine
  • Nicolet NXR 1500-I X-ray Inspection Station
  • Endoscope

Topics Covered:

  • BGA reballprofiling
  • Device preparation
  • Device cleaning and inspection
  • EZReball™ usage
  • Reflow
  • Cleaning and inspection

This is a 1-day, hands-on course. It is a basic skills course, designed to teach you how to reball devices. Students will demonstrate BGA reballing and repair skills by the end of the class.

Each candidate who successfully completes the training will receive a participation certificate.

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