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BEST XRAY capabilities include an enhanced image processing software package which provides BGA and BGA/device void measurements, analysis and reporting. The software provides advanced image processing features required to perform both advanced XRAY analysis and fault detection. This allows BEST to perform automated sorting based on advanced criteria developed by you in conjunction with the process engineers at BEST. Once the criteria, such as roundness, void percentage or ball size have been designated, the software can go through and measure each ball automatically on the BGA ensuring very precise and repeatable sorting. In addition the software can be used to create a 3D rendering of the image for a unique perspective for inspection.
The following are just a few of the examples of the advanced capabilities of the system:
BGA ball size measurement
PASS/FAIL criteria
The software can download all of the BGA analytical data to a spreadsheet for your QC and problem tracking purposes.
The advanced X-RAY system and the depth of experience at BEST Inc developed through reworking thousands of BGAs allows BEST to offer the following services with a high level of confidence:
- Experienced interpretation of results with assistance in identifying the potential root cause of failures.
- Product screening for void detection based on percentage of void in a solder joint or solder ball diameter
- Product screening for detection of contamination and/or foreign material.
- Product screening for broken wire bonds
- Assist in your failure analysis efforts by providing high-resolution x-ray imaging from every conceivable angle and view.
Return to the X-RAY page.
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