BGA rework, bga repair, bga rework process, bga removal and replacement


Dry packaging BGA

Dry Packaging

Sealing of MSD Bags All BEST reballed components are immediately placed into ESD safe moisture barrier bags along with a fresh desiccant after reballing. A moisture strip is included as well inside of the packaging. The bag is properly marked with critical information such as date and time of packaging. These procedures insure that the devices will be kept dry and properly protected until they are required for use.

General BGA/CSP Reballing Process
Handling of BGAs
StencilQuik™ Fixturing Technique
Solder Preform Technique
Dry Packaging
Ceramic Package Reballing
Reballing Challenges
Optional Services

 





 

To find out more about BGA packages, and the assembly and rework of BGA's, please see;
(PDF files)

LGA Rework & Assembly 1
LGA Rework & Assembly 2
LGA Rework & Assembly 3
LGA Rework & Assembly 4

Circuit Assembly's 2006 Service Excellence Award

 
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