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Automated Optical Inspection | Laser Marking | Ionic Cleaning | Taping & Reeling
There are a variety of end customer requirements which sometimes call for
additional processing in the BGA reballing process. These steps could
include some form of automated optical inspection, laser etching, retaping
of parts, or localized ionic contamination level testing.
We offer all of these services for complete success in your rework project.
BGA / CSP Inspection. 100% inspection of ball diameter, ball quality,
missing balls and co planarity is done with an automated optical inspection
system. Set-up and programming time as well as processing time are a part
of this service.
BEST offers accurate laser marking using a CO2 laser system. Laser
marking can incorporate any size fontsor graphic images as small as 5x5(mm).
If the devices were initially purchased having lead-free alloy balls and we have
re-attached leaded balls, we suggest the following symbol be LASER marked (E0).
If the devices were initially purchased having tin-lead alloy balls and we have
re-attached lead-free balls, we suggest the following symbol be LASER marked
(E1).
An ion chromatograph (IC) is the most common tool for precision testing
of device cleanliness. This method can quantify and identify specific ionic
species that are present on an electronic device. The most common test
method followed is the IPC TM-650 2.3.28. The device is placed into an
ionically-clean bag (e.g. Kapak), and is immersed in an extract solution of 75%
isopropyl alcohol (IPA) to 25% de-ionized water. It is important to be
sure that the sampling procedures do not introduce any ionic contaminates.
The PCB is extracted in the solution for one hour at 80 degrees centigrade, the
resulting extract is then injected into the ion chromatograph. The IC then
separates and detects each individual ion for which it was calibrated. Click
here to see an Ionic Cleanliness testing report
(PDF).
The taping and reeling of electronic components will protect them
from the dangers of ESD., transportation and atmospheric change. In
addition, the components are presented to Pick & Place machines in a fashion
which optimizes the efficiency of the mounting process.
When product is delivered to a Reel Service facility, it is immediately
subject to strict climate and ESD controls. It is initially logged into
our computer tracking system, inspected and scanned for rejects. The
components are then transferred to our production area, where they can be taped
and reeled manually or automatically. !00% inspection and vision systems
can supplement the process. The finished reels are then transferred to
shipping to be vacuum packed and prepared for delivery.
General BGA/CSP Reballing Process
Handling of BGAs
StencilQuik™ Fixturing Technique
Solder Preform Technique
Dry Packaging
Ceramic Package Reballing
Reballing Challenges
Optional Services
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