Handling of BGAs
ESD Handling of Devices

ESD Safe Work Areas
BGAs should be handled in ESD-safe work areas in order to prevent damage to sensitive components from electrostatic discharges. These areas must be designed and maintained to prevent ESD damage.

Proper Handling and Storage of ESD Sensitive Devices
The following practices should be adhered to when working with area array components:

1. Devices should be handled at properly designated work areas only

2. Designated ESD safe work areas must be checked periodically to ensure their continued safety from ESD. The areas should be monitored for the following:
   1. Proper grounding methods.
   2. Static dissipation of work surfaces.
   3. Static dissipation of floor surfaces.
   4. Operation of ion blowers and ion air guns.

3. Designated work areas must be kept free of static generating materials such as styrofoam, vinyl, plastic, fabrics or any other static generating materials.

4. Work areas must be kept clean and neat in order to prevent contamination of the work area.

5. Components should be handled by the edges or with proper ESD-safe tooling. Avoid touching the component leads

6. When not being worked on, sensitive components must be enclosed in shielded bags or boxes. There are three types of ESD protective enclosure materials including:
   • Antistatic - Provides antistatic cushioning for electronic assemblies.
   • Static Shielding - Prevents static electricity from passing through the package.
   • Static Dissipative - An "over-package" that has enough conductivity to dissipate any static buildup.

7. Whenever handling an area array device the operator must be properly grounded by one of the following:
   1. Wearing a wrist strap connected to earth ground.
      
   2. Wearing 2 heel grounders and have both feet on a static dissipative floor surface.

8. Stacking of devices should be avoided to prevent physical damage. Special racks and trays are provided for handling.

MSD Control-Preparation of Area Array Devices All moisture sensitive devices should be handled as per IPC/JEDEC J-STD-020A and IPC JEDEC J-STD-033 standards. General BGA/CSP Reballing Process Handling of BGAs StencilQuik™ Fixturing Technique Solder Preform Technique Dry Packaging Ceramic Package Reballing Reballing Challenges Optional Services