BGA Reballing Challanges

BGA Reballing Challanges | 847-797-9250

BGA Reballing Challenges

There are some common areas inexperienced BGA assembly technicians may run into in the reworking of BGAs including:

Popcorning and component damage -this is particularly prevalent on very thin devices (MSD Class 1)
Component damage due to overheating
Improper temperature profile
Application of solder paste on the land patterns on ceramic parts

Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.

General BGA/CSP Reballing Process
Handling of BGAs
StencilQuik™ Fixturing Technique
EZReball (TM) Preform Technique
High Volume Automated Machinery
Dry Packaging
Ceramic Package Reballing
Reballing Challenges
Optional Services

To find out more about BGA packages, and the assembly and rework of BGA's, please see;
(PDF files)

LGA Rework & Assembly 1
LGA Rework & Assembly 2
LGA Rework & Assembly 3
LGA Rework & Assembly 4

Circuit Assembly's 2006 Service Excellence Award

3603 Edison Place - Rolling Meadows, IL 60008 - Phone 847.797.9250 - Fax 847.797.9255