Ceramic Package or High Temperature Solder Ball Reballing
One of the additional steps required when reballing either ceramic package area array devices or devices requiring the use of high temperature balls is the selective application of solder paste to the pads on the underside of the package. There are a variety of methods used to selectively deposit solder paste to the underside of the device. These include miniature metal stencils, solder paste deposition and flexible removable stencils.

General BGA/CSP Reballing Process
Handling of BGAs
StencilQuik™ Fixturing Technique
Solder Preform Technique
Dry Packaging
Ceramic Package Reballing
Reballing Challenges
Optional Services