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There are some common areas inexperienced BGA assembly technicians may run into in the reworking of BGAs including:
- PCB distortion due to overheating -this is particularly prevalent on very thin boards
- Problems in screening using the metal stencil application technique. Care must be taken to make sure the screen is properly cleaned and that paste is released from each of the apertures . Otherwise there will be opens in the BGA connections. Using the StencilQuik™ method there are no stencil release issues.
- Rework of BGAs placed directly opposite to one another, especially with shared vias need critical attention to reflow temperatures
- Inadequate attention to nearby BGAs being in close proximity thereby sending them into secondary reflow
- Inadequate attention to nearby heat sensitive parts which may become warped or destroyed during the reflow or device removal process
Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.
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