BGA Rework Process - Part Removal

The objective of this step is to remove the component while minimizing the impact to the PCB. The most common PCB defects that should be avoided include lifted pads and site warping. The basic requirements of this operation are the following:

1. Preheat the entire PCB between 75° C and 125°C
2. Insure that all joints have a temperature greater than 190°C
3. Make sure that all joint temperatures are less than 220°C.
4. Insure no solder is smeared on the part bottom or edge which might aid in part reclamation
5. Maintain adjacent component temperatures to less than 180°C in order to minimize the heat impact on these parts