Lead Free Rework
Successful rework and assembly methods have been developed with lead-free solders for all types of components. During the transition period to lead-free manufacturing rework practices have to be developed that deal with the issues related to handling, reworking, tracking and inspecting lead free PCB assemblies.
Lead Free Repair

 XRAY Inspection
A strong supplemental tool to XRAY, a boroscopic inspection tool, allows hidden solder joint or joints that are in close proximity to other nearby parts to be inspected and characterized. BEST has the capability to inspect and troubleshoot process defects through the use of this tool.
XRAY Inspection

 Visual Inspection
XRAY imaging is a widely utilized analytical tool for the SMT PCB manufacturing process. In PCB assembly area array packages such as CGA, BGAs and CSPs with their concealed solder joints, have become the main field of application for X-ray inspection.
Visual Inspection

Soldering Tip Videos
BEST IPC Master Instructors have put together hands-on demo videos for common soldering practices.
Soldering Tip Videos

Ask the Expert
If you have a question or seek advice send in your questions and a BEST subject matter expert on training, PCB rework and repair or electronics assembly will reply.
Ask the Expert

BGA Rework Process
The following describes the general BGA rework process covering the development and criteria for establishing profiles for BGA removal and replacement.
BGA Rework Process

Underfill Rework
The following describes the general BGA rework process covering the development and criteria for establishing profiles for BGA removal and replacement.
Underfill Rework

Reballing
See the various processes for reballing 1-2 devices, low volume and high volume using an automated machine below
Reballing

SMT Terms
Look up a term, suggest a new one or use this list for reference.
SMT Terms

Newsletters
Subscribe to the monthly newsletter on tips and tricks in PCB rework and repair or search the archives.
Newsletters